| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce temperature cycle stress solder 7 receives by a simple structure without any necessity of projections or the like even if a low-cost material such as copper and aluminum is used for a metal base plate 1. SOLUTION: The semiconductor device comprises a plurality of semiconductor circuits, the bonding members 7, and the metal base plate 1. Each of the semiconductor circuit sections comprises a ceramic substrate 2, a first face-side wiring pattern 4 formed on a first face of the ceramic substrate 2, a second face-side wiring pattern 5 formed on a second face of the ceramic substrate 2, and one or two semiconductor elements 3 mounted on the first face-side wiring pattern 4 side of the ceramic substrate 2. Each bonding member 7 is applied over the entire area of the second face of the ceramic substrate 2 including a region immediately below the semiconductor element 3 on the second face-side wiring pattern 5 side of the ceramic substrate 2 in each semiconductor circuit section. The metal base plate 1 is formed of a metallic material having a coefficient of linear expansion larger than that of the ceramic substrate 2, and the plurality of semiconductor circuits are bonded to the metal base plate 1 via the bonding members 7. COPYRIGHT: (C)2005,JPO&NCIPI |
