| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid film forming method in which a solid film of an approximately even thickness along the surface of a substrate is obtained, when forming a liquid film on the substrate having a step, removing a solvent in the liquid film, and forming the solid film. <P>SOLUTION: The solid film forming method has a process of discharging a solution in which a solid content is dissolved in the solvent, for a substrate 401 which has concaves and convexes of step heights d, in which the ratio of the area of the convex to the whole area is a (1> a> 0), and the ratio of the area of the concave to the whole area is 1-a, moving relatively a discharging nozzle and the substrate 401, and forming the liquid film 402 on the substrate 401, and a process of removing the solvent in the liquid film 402, and forming the solid film 403 which is composed of the solid content. At the time of forming the liquid film 402, the thickness h of the liquid film 402 satisfies a relation of h>(11-a) d. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
