| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor surface protecting method and a surface protection sheet in which a material used has sufficient tracking ability for unevenness on the circuit surface of a semiconductor wafer, sufficient rigidity as a support during grinding, and is never fluidified with repetitive rise of temperature. SOLUTION: The surface protection sheet is used to protect the circuit surface during the backside grinding process of the semiconductor wafer. In this surface protection sheet, the surface protection layer is formed on a polymer film material as solidified under the room temperature, fluidified when heated, and cured when irradiated with the radiation or heated. COPYRIGHT: (C)2005,JPO&NCIPI |
