发明名称 Modeling process for integrated circuit film resistors
摘要 A method is presented, in which a thin film resistor is modeled to account for self-heating. The method includes fabricating the thin film resistor and characterizing a thermal resistance of the thin film resistor, wherein the thermal resistance accounts for self-heating thereof during operation. The thermal resistance is then used in a model for simulating integrated circuits using the thin film resistor.
申请公布号 US2005124079(A1) 申请公布日期 2005.06.09
申请号 US20030728068 申请日期 2003.12.04
申请人 STEINMANN PHILIPP;CHATTERJEE AMITAVA;WEISER DOUG;BUCKSCH ROLAND 发明人 STEINMANN PHILIPP;CHATTERJEE AMITAVA;WEISER DOUG;BUCKSCH ROLAND
分类号 G01R31/28;H01L21/02;H01L27/01;(IPC1-7):H01L21/66;G01R31/26;H01L21/20 主分类号 G01R31/28
代理机构 代理人
主权项
地址