发明名称 |
Modeling process for integrated circuit film resistors |
摘要 |
A method is presented, in which a thin film resistor is modeled to account for self-heating. The method includes fabricating the thin film resistor and characterizing a thermal resistance of the thin film resistor, wherein the thermal resistance accounts for self-heating thereof during operation. The thermal resistance is then used in a model for simulating integrated circuits using the thin film resistor.
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申请公布号 |
US2005124079(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20030728068 |
申请日期 |
2003.12.04 |
申请人 |
STEINMANN PHILIPP;CHATTERJEE AMITAVA;WEISER DOUG;BUCKSCH ROLAND |
发明人 |
STEINMANN PHILIPP;CHATTERJEE AMITAVA;WEISER DOUG;BUCKSCH ROLAND |
分类号 |
G01R31/28;H01L21/02;H01L27/01;(IPC1-7):H01L21/66;G01R31/26;H01L21/20 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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