发明名称 |
Electrolytic plating method and device for a wiring board |
摘要 |
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
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申请公布号 |
US2005121314(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20040896488 |
申请日期 |
2004.07.22 |
申请人 |
KABUSHIKI KAISHA TOYODA JIDOSHOKKI SEISAKUSHO |
发明人 |
INOUE TOSHIKI;KUMAGAI KYOKO |
分类号 |
C25D3/38;C25D5/18;C25D7/00;C25D21/14;H05K3/18;H05K3/42;H05K3/46;(IPC1-7):C25D17/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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