| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which connects a connection terminal of a chip and an antenna circuit with satisfactory connection reliability even when chip size is small. <P>SOLUTION: In the semiconductor device consisting of a circuit layer on which an antenna pattern and a pattern for IC connection are formed, electronic components such as an IC, capacitor and connection member which electrically connects them, the circuit layer etched by forming a resist by gravure printing is used for the circuit layer and a chip with double-sided electrode in which electrodes to be connected to the circuit layer are formed on the front and the rear of the chip with chip size of ≤0.5 mm is used for the IC to be mounted on the circuit layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
