| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing semiconductor device by which the reliability of a semiconductor device can be improved. SOLUTION: The method includes a step (a) of providing a reinforcing member on one surface of a wiring board, which has a first region for mounting a semiconductor chip, a second region surrounding the first region, and terminals extended from the first region to the second region and provided on the other surface, in a state where the reinforcing member overlaps the terminals and is partially protruded to the second region from the first region. The method also includes a step (b) of cutting the terminals along the boundary between the first and second regions by punching the terminals from the surface sides of the terminals on the wiring board, and a step (c) of continuously cutting the reinforcing member from the inside to the outside along the boundary between the first and second regions by punching the reinforcing member from the surface side on the wiring board. COPYRIGHT: (C)2005,JPO&NCIPI |
