发明名称 ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching method capable of forming a large hollow or a space having a complicated configuration with high formal accuracy by etching a sacrificial layer through a very small etching opening. SOLUTION: A work as an object of processing is exposed to a processing fluid containing an etching reactant so as to undergo an etching treatment (a third step S3, a fourth step S4), and thereafter a processing chamber is reduced in internal pressure so as to make the processing fluid near the work lower in density than that at the fourth step S4 (a first step S1). When these steps S1 to S4 are repeatedly carried out, the new processing fluid containing the etching reactant is supplied to a processing atmosphere where the work is arranged at the steps S3 and S4 which are carried out after the first step S1, so that the processing fluid near the work is increased in density than that at the first step S1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150332(A) 申请公布日期 2005.06.09
申请号 JP20030384657 申请日期 2003.11.14
申请人 SONY CORP 发明人 AISAKA TSUTOMU
分类号 B81C1/00;B81B3/00;H01L21/302;H01L21/304;H01L21/311;(IPC1-7):H01L21/302 主分类号 B81C1/00
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