发明名称 SURFACE MOUNT COMPOSITE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
摘要 <p>Disclosed is a surface mount composite electronic component which can be small-sized. Such a surface mount composite electronic component has a structure wherein a circuit device (2) is respectively formed on a pair of opposing surfaces of an insulating substrate (1) which is composed of a hexahedron, and an electrode (3) of the circuit device (2) also serves as an external terminal. The surface mount composite electronic component comprises, for example, a pair of first electrodes (1a) arranged on both ends of the front surface of the hexahedral insulating substrate (1), a pair of second electrodes (1b) arranged on the rear surface of the insulating substrate so that they are opposite to the first electrodes (1a), a first resistor (4a) arranged in contact with both of the first electrodes (1a), and a second resistor (4b) arranged in contact with both of the second electrodes (1b).</p>
申请公布号 WO2005050677(A1) 申请公布日期 2005.06.02
申请号 WO2004JP16828 申请日期 2004.11.12
申请人 MINOWA KOA INC.;FUJIMOTO, KOJI 发明人 FUJIMOTO, KOJI
分类号 H01C1/16;H01C13/02;H01C17/00;H01C17/28;H05K3/34;(IPC1-7):H01C7/00 主分类号 H01C1/16
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