| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable wiring board whose opening shape is proper in patterning of solder resist of the wiring board having a plurality of conductor circuits in a resin insulating layer, and to provide a manufacturing method of the wiring board for improving productivity by a reel-to-reel method. <P>SOLUTION: In the manufacturing method of the wiring board having a solder resist layer on an outermost layer of one side of the board, an exposure processing is performed twice in the same part of an opening at the forming of the opening in the solder resist layer. Different photomasks are used in the first exposure processing and in the second exposure processing. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
