发明名称 EXPOSURE METHOD, EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve throughput and to prevent deterioration in total pitch accuracy of a pattern in exposure of a glass substrate using a proximity method. SOLUTION: A mask 20 held by a mask holder 21 is located above an exposure position where a glass substrate is to be exposed. Loading/unloading positions (a), (b) to load and unload a glass substrate on or from chucks are disposed on either side of the exposure position. A chuck 10a is moved between the loading/unloading position (a) and the exposure position and a chuck 10b is moved between the loading/unloading position (b) and the exposure position by the movement of an X stage. While a glass substrate on one chuck is exposed at the exposure position, another glass substrate is loaded/unloaded on and from the other chuck at the loading/unloading position and cooled on the other chuck. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005140935(A) 申请公布日期 2005.06.02
申请号 JP20030376238 申请日期 2003.11.05
申请人 HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO LTD 发明人 KOMATSU NOBUHISA;TAKAHASHI SATOSHI;SEKI KAZUMASA
分类号 G03F7/20;H01J37/20;H01L51/50;H05B33/10;H05B33/14;(IPC1-7):G03F7/20 主分类号 G03F7/20
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