| 发明名称 |
Mounting plate for use with electrical circuit boards has a layer of electrically insulating resin as contact surface |
| 摘要 |
<p>The mounting plate [2] for use with an electronic circuit board has a number of raised pads having grooves [8]. The region is filled with an insulating resin (4) to a level. The circuit plate is placed on this and is in contact with the resin to provide electrical insulation relative to the carrier.</p> |
| 申请公布号 |
DE202005004295(U1) |
申请公布日期 |
2005.06.02 |
| 申请号 |
DE20052004295U |
申请日期 |
2005.03.16 |
| 申请人 |
SIEMENS AG |
发明人 |
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| 分类号 |
H05K3/28;(IPC1-7):H05K1/02;H05K7/00;H05K13/00 |
主分类号 |
H05K3/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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