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发明名称
感光性玻璃基板之贯穿孔形成方法
摘要
本发明之目的为在感光性玻璃基板上形成多个一样且细微直径的贯穿孔。对基板状感光性玻璃1照射紫外光4而形成潜像2,并藉由施行热处理,使潜像部分结晶化,再将结晶化的部分蚀刻去除而形成贯穿孔5,接着,藉由将感光性玻璃1之表背面去除至AA’与BB’为止,将贯穿孔之孔径在长度方向之均匀性作成容许范围内。
申请公布号
TW200518655
申请公布日期
2005.06.01
申请号
TW093129975
申请日期
2004.10.04
申请人
HOYA股份有限公司
发明人
桥本和明;小泽润;本村欣也
分类号
H05K3/00;H01L21/306
主分类号
H05K3/00
代理机构
代理人
赖经臣
主权项
地址
日本
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