Arrangement and method of applying adhesive, substrate to be adhesively fixed and the use of an encapsulation method

摘要

Capsules(1) filled with a first adhesive(2) are connected via a carrier material(4) which may also form the capsules. Outer sides of the capsules and/or carrier material are at least partly coated with a second adhesive(3) which temporarily holds capsules onto the substrates until the first adhesive sets. The entire outer surface of the capsules(1) is coated with the second adhesive(3). Several capsules connected by a carrier (4) form a strip or a matrix. Each capsule may be opened by a tear-open strap and straps may be connected to allow simultaneous opening. Carrier material may comprise a net which is joined to each capsule via a specific number of points. In an alternative design the capsules have weak points which allow easy opening of the capsules through increased internal pressure. Capsules may be divided into chambers, each containing a component of a multi-component adhesive. Independent claims are included for: a) a method for applying a first bonding adhesive(2) onto two or more substrates(7) using the claimed system in which capsules full of a first adhesive are fixed to at least one substrate by a second adhesive on the outside of the capsules and/or carrier material and then the capsules are opened to allow adhesive to flow out onto surfaces to be bonded; b) use of the rotary die process for encapsulating adhesive to produce the capsules; c) a substrate for bonding onto a further substrate and one or more surfaces of the substrate are bonded using the claimed system.