发明名称 |
Integrated circuit device and wiring board |
摘要 |
A semiconductor device has a plurality of first pads to a plurality of fourth pads laid out in a first direction, thereby forming first to fourth pad rows. The first to fourth pad rows are laid out in the named order in a second direction orthogonal to the first direction. First to fourth leads are respectively connected between the first to fourth pad rows and a semiconductor chip. A first slanted side inclined to the first direction is formed at each second pad at that corner which lies on that side of the third pad row. A second slanted side inclined to the second direction in such a way as to face the first slanted side is formed at each third pad. Each first lead has a first slanted portion provided between the first slanted side and the second slanted side and extending in a direction oblique to the first direction.
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申请公布号 |
US6899544(B2) |
申请公布日期 |
2005.05.31 |
申请号 |
US20040853493 |
申请日期 |
2004.05.26 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TANOKURA MASARU;YANAGITA YUKIO |
分类号 |
H01L21/60;H01R4/02;H01R43/02;H05K1/00;H05K1/02;(IPC1-7):H01R9/09 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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