发明名称 |
Photodiode array and method for establishing a link between a first semiconductor element and a second semiconductor element |
摘要 |
The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.
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申请公布号 |
US2005110025(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20050501209 |
申请日期 |
2005.01.06 |
申请人 |
FURST ROBERT;KAMPF MATHIAS;RING MELANIE;SINGER FRANK |
发明人 |
FURST ROBERT;KAMPF MATHIAS;RING MELANIE;SINGER FRANK |
分类号 |
H01L27/146;H01L31/02;H01L31/101;H01L31/18;H01S5/022;(IPC1-7):H01L27/15;H01L29/26 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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