| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate transfer implement which is capable of transferring a very thin semiconductor substrate from a certain processing stage to a following processing stage without causing damage to the semiconductor substrate. SOLUTION: The substrate transfer implement 1 has a configuration wherein a rigid disk-shaped base mount 6 provided with fluid paths 6a communicating in a vertical direction is provided on the lower surface of the dome ceiling board 5 of a dome-shaped substrate pressing frame 3 formed of rigid material, a fluid chamber 40 is composed of the substrate pressing frame 3 and the disk-shaped base mount 6, a communicating air bubble disk-shaped sponge 11 is spot-bonded 42 or line-bonded 42 to the lower surface of the rigid disk-shaped base mount 6 so as to enable its lower surface to protrude from the lower surface of the annular projection frame of the substrate pressing frame 3 by a distance of 0.5 to 2 mm, and a head 2 which uses the lower surface of the sponge 11 as a substrate holding surface is fixed to an arm 14 in a manner wherein it revolves freely or moves freely back and forth. The substrate transfer implement 1 is used, a cleaning solution is fed to the fluid chamber 40 to moisten the sponge 11, the sponge 11 is made to descend to bear against the surface of the substrate whereby some of the cleaning solution is discharged out of the sponge 11 to turn the pressure of the fluid chamber negative, and the substrate W is stuck on the surface of the sponge 11. COPYRIGHT: (C)2005,JPO&NCIPI |
