发明名称 Method for manufacturing conductive pattern forming body
摘要 It is a main object of the present invention to provide a method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. In order to attain the above object, the present invention provides a method for manufacturing a conductive pattern forming body comprising: a pattern forming body substrate preparing process of preparing pattern forming body substrate comprising a base material, and a photocatalyst containing layer formed on the base material comprising a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced; a wettability pattern forming process of forming wettability pattern comprising a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy; a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and a conductive pattern forming process of forming conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.
申请公布号 US2005112810(A1) 申请公布日期 2005.05.26
申请号 US20030649212 申请日期 2003.08.27
申请人 KOBAYASHI HIRONORI 发明人 KOBAYASHI HIRONORI
分类号 C23C18/12;G03F7/004;G03F7/075;G03F7/40;H05K3/12;(IPC1-7):H05K1/03 主分类号 C23C18/12
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