发明名称 MANUFACTURING METHOD FOR LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated electronic component in which defects such as a delamination, a short circuit or the like generated in the laminated electronic component even when the suction of air of a ceramic pattern formed around a conductor pattern on a ceramic green sheet is inhibited, and the ceramic green sheet and the conductor pattern are thinned and laminated to a high degree and the laminated type electronic component having a high reliability is obtained. SOLUTION: Trenches 6 are formed along the longitudinal direction of the conductor patterns 3 and 15, in the regions of the ceramic patterns 5 and 17 formed around the conductor patterns 3 and 15. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136008(A) 申请公布日期 2005.05.26
申请号 JP20030368007 申请日期 2003.10.28
申请人 KYOCERA CORP 发明人 OOTA HITOSHI
分类号 H01G4/12;H01F17/00;H01F41/04;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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