| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a card with built-in semiconductor and capable of suppressing separation between a semiconductor mounting board and a card frame to a high degree when a bending stress is applied while satisfying the requirement of reduction in size and thickness. <P>SOLUTION: This card with built-in semiconductor comprising a substrate on which a semiconductor is mounted and a card frame as constituent parts is characterized in that a stress relaxation layer is interposed between the substrate and the card frame. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
