| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a suspension substrate with circuit, with which the appearance defects and product defects due to a metal supporting layer can be prevented and an electroless nickel plating layer of uniform thickness can be surely formed. SOLUTION: A base insulating layer 3 is formed on a support substrate 2 in a prescribed pattern. A chromium thin film 10 and a copper thin film 11 are sequentially formed on the surface of the support substrate 2 exposed from the base insulating layer 3 and over the whole face of the base insulating layer 3. Conductor layers 4 are formed on the surface of the copper thin film 11 by a wiring circuit pattern, and the copper thin film 11 is removed from the part, except the conductor layer 4. Then, the electroless nickel plating layers 14 are formed to cover the conductor layers 4. The chromium thin film 10, other than a part covered with the electroless nickel plating layer 14, is removed, and a cover insulating layer 15 is formed so as to cover the conductor layers 4, and the suspension substrate with a circuit 1 is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
|
