| 摘要 |
A processing unit of the invention is a single wafer processing unit including: a processing container that can be vacuumed; a stage arranged in the processing container, on which an object to be processed can be placed; a dischargingpipe connected to a bottom part of the processing container and extending substantially downward linearly; a vacuum pump directly connected to the discharging pipe; and a stage-supporting pillar arranged to extend in a substantially central portion of the discharging pipe and in a direction of the discharging pipe, the stage-supporting pillar supporting the stage. <IMAGE> |
