Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

摘要

A wiring pattern is formed over a semiconductor wafer, and an external terminal is formed on the wiring pattern. The wiring pattern extends from a pad which is part of an interconnect to an integrated circuit formed in the semiconductor wafer. A non-resin layer of a non-resin material is formed in a first region of the semiconductor wafer. A resin layer is formed in a second region which is a region of the semiconductor wafer other than the first region by utilizing the non-resin layer. The semiconductor wafer is cut long the first region.