发明名称 |
Programmable multi-chip module |
摘要 |
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.
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申请公布号 |
US6897078(B2) |
申请公布日期 |
2005.05.24 |
申请号 |
US20030697898 |
申请日期 |
2003.10.30 |
申请人 |
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES |
发明人 |
KAUTZ DAVID;MORGENSTERN HOWARD;BLAZEK ROY J. |
分类号 |
H01L21/66;H05K1/00;H05K1/03;H05K1/14;H05K1/18;H05K3/28;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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