| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multi-layer wiring circuit board and a micro-chemical chip which have circuit wiring therein an electrical characteristic of which is less varied even when are small-sized and have a heat generating part. <P>SOLUTION: The multi-layer wiring circuit board comprises a substrate 1 having a plurality of stacked dielectric layers, a resistance heater 2 formed at least one of a surface of the substrate 1 and an interior thereof, internal wiring formed in the interior of the substrate 1, and a cavity 6 formed in the interior of the substrate 1 under the resistance heater 2. The internal wiring includes an inductor 4 and a capacitor 5. The capacitor 5 is located in the interior of the substrate 1 on a side thereof lower than the cavity 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
