| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package adapted to miniaturization and the reduction of cost. SOLUTION: In the electronic component package, a lid member is overlapped with a ceramic vessel so that a sealing member arranged at a peripheral edge on one face of a metallic lid member and a plane shape having a recessed part on an upper face are brought into contact with a metallized part formed on the upper face of an outer peripheral frame of the rectangular ceramic vessel, and the electronic component stored in the recessed part of the ceramic vessel is hermetically sealed by fixing the sealing member and the metallized part. The length of the side of the ceramic vessel is 3.2 mm or less, the thickness is 1.0mm or less, and the thickness of the outer peripheral frame is 0.3 to 0.5 mm. An electrode for seam welding is made to abut only on one side of the ceramic vessel and seam welding is performed. COPYRIGHT: (C)2005,JPO&NCIPI
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