| 摘要 |
The invention concerns an application device and a method for filling hidden gaps with adhesives or sealants. This application device comprises a supply line (2) placed, in part, in a supply gap (3). This supply line comprises an opening (4), which is essentially oriented in the direction of the gap (1) to be filled, and comprises means (5) for at least temporarily sealing the gap to be filled. The planes of the supply line and those of the gap to be filled are situated at an angle alpha to one another. The invention also concerns a method for filling hidden gaps and to the articles sealed or bonded using such a method. |
