| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a firing method etc., for preventing crack formation, layer separation, etc., caused by differential shrinking during heating in a firing step of a laminated ceramic electronic component or a film-structured electronic component such as a laminated piezoelectric ceramic actuator and a laminated piezoelectric ceramic transformer. <P>SOLUTION: In the firing method, pressure sintering is achieved by applying a centrifugal force in the direction perpendicular to the film or the interface of the laminate in the firing step of the film or the laminate structure on a substrate. This drastically reduces shrinkage in the direction parallel to the film or the interface of the layers to prevent the occurrence of defects. In the firing method, interfacial adhesion strength is improved through matching of bonded interfaces. The film, the laminate structure and the film-form or laminated electronic member are manufactured using the firing method. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
