发明名称 PHENOLIC RESIN MOLDING COMPOUND
摘要 PROBLEM TO BE SOLVED: To obtain a phenolic resin molding compound excellent in injection moldability and sliding properties. SOLUTION: The phenolic resin molding compound is obtained by formulating a resol phenolic resin with graphite and a polyethylene resin powder. In a particular embodiment, the phenolic resin molding compound is obtained by formulating 100 pts. wt. resol phenolic resin with 110 to 160 pts. wt. graphite and 0.1 to 1 pt. wt. polyethylene resin powder. It is desirable that the resol phenolic resin has a number-average molecular weight of 400 to 900. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005126548(A) 申请公布日期 2005.05.19
申请号 JP20030362904 申请日期 2003.10.23
申请人 SUMITOMO BAKELITE CO LTD 发明人 YAMASHITA CHITOSHI
分类号 C08L61/10;C08K3/04;(IPC1-7):C08L61/10 主分类号 C08L61/10
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