| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip manufacturing method wherein IC chips are processed without damage even when the wafer is ground extremely thin. SOLUTION: The IC chip manufacturing method for manufacturing IC chips out of a wafer comprises at least a step 1 wherein a wafer is fixed to a supporting board by a double-faced adhesive tape with its either or both sides reduced in adhesive strength upon being stimulated, a step 2 wherein grinding is performed for the wafer fixed to the supporting board by the double-faced adhesive tape, a step 3 wherein a dicing tape is attached to the surface of the ground side of the wafer, a step 4 wherein the double-faced adhesive tape is stimulated for a reduction in adhesive strength between the double-faced adhesive tape and the wafer, and a step 5 wherein the supporting board is lifted from the wafer. The adhesive agent whose adhesive strength is reduced in response to stimulation exhibits a gel fraction of≥85% and an elongation of≤300% in the thickness direction upon being stimulated. In the step 5 for lifting the supporting board from the wafer, the supporting board is first inclined by 1-5°, stopped there temporarily, and then lifted. COPYRIGHT: (C)2005,JPO&NCIPI |
