| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem or a defect that an adhesive agent layer is adhered to a dicing frame in an adhesive tape for dicing die bond and, therefore, a method wherein another adhesive tape is worked so as to have a predetermined shape and is bonded or the like is employed to prevent the adhesive agent from sticking, however, expense for material and working is expensive and, further, treatment processes are increased. SOLUTION: The adhesive tape (1) is constituted sequentially of the adhesive agent layer (3), a substrate film (2) and another adhesive agent layer (4) so that a separating force between the substrate film (2) and the adhesive agent layer (3) is made smaller than exfoliation force between the substrate film (2) and the other adhesive agent layer (4). COPYRIGHT: (C)2005,JPO&NCIPI |
