| 摘要 |
PROBLEM TO BE SOLVED: To achieve much more microfabrication and much higher integration of a wiring film 16 of a wiring board 2 while assuring reliability. SOLUTION: On at least one surface of the board 2, a pattern thin film 12 is to be formed in a predetermined pattern with metallic particles or metal oxide particles of nano meter scale with mean particle diameter as 1-100 nm. The film 12 is formed as a mother film by using an ink jet method, a dispenser, screen-stencil, etc., and dried. Solvent etc. are vaporized. By heating (150-250°C) of the film 12, the metallic particles (objects in which the metal oxide particles are turned into metallic particles by reduction are contained) are bonded to each other, melting is performed, and a metal film 14 is formed on the pattern thin film 12 which constitutes the mother film. The wiring film 16 is constituted of the metal plating film 14 and the pattern thin film 12 as the mother film of the film 14. COPYRIGHT: (C)2005,JPO&NCIPI |
