发明名称 Inductor formed in an integrated circuit
摘要 An inductor formed within an integrated circuit and a method for forming the inductor. The inductor comprises an underlying layer of aluminum formed in a first metallization layer and patterned and etched into the desired shape. In one embodiment the aluminum line comprises a spiral shape. According to a damascene process, a conductive runner, preferably of copper, is formed in a dielectric layer overlying the aluminum line and in electrical contact therewith. The aluminum line and the conductive runner cooperate to form the inductor. In another embodiment the aluminum line and the conductive runner are formed in a vertically spaced-apart orientation, with tungsten plugs or conductive vias formed to provide electrical connection therebetween. A method for forming the inductor comprises forming an aluminum conductive line and forming a conductive runner over the conductive line.
申请公布号 US2005099259(A1) 申请公布日期 2005.05.12
申请号 US20040953475 申请日期 2004.09.29
申请人 HARRIS EDWARD B.;MERCHANT SAILESH M.;STEINER KURT G.;VITKAVAGE SUSAN C. 发明人 HARRIS EDWARD B.;MERCHANT SAILESH M.;STEINER KURT G.;VITKAVAGE SUSAN C.
分类号 H01L21/768;H01F41/04;H01L21/02;H01L21/3205;H01L21/822;H01L23/12;H01L23/485;H01L23/52;H01L23/522;H01L27/04;H01L27/08;(IPC1-7):H01F5/00 主分类号 H01L21/768
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