发明名称 Method of cutting material for use in implantable medical device
摘要 A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.
申请公布号 US2005098547(A1) 申请公布日期 2005.05.12
申请号 US20040007732 申请日期 2004.12.08
申请人 CALI DOUGLAS S.;MYERS KEITH E. 发明人 CALI DOUGLAS S.;MYERS KEITH E.
分类号 A61F2/24;B23K26/32;B23K26/40;(IPC1-7):A61F2/24;B23K26/38;B23K26/20 主分类号 A61F2/24
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