发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 A semiconductor integrated circuit device comprises a semiconductor substrate; an insulating layer formed on the semiconductor substrate; a semiconductor layer insulated from the semiconductor substrate by the insulating layer; source regions of a first conduction type and drain regions of the first conduction type both formed in the semiconductor layer; body regions of a second conduction type formed in the semiconductor layer between the source regions and the drain regions to store data by accumulating or releasing an electric charge; word lines formed on the body regions in electrical isolation from the body regions to extend in a first direction; bit lines connected to the drain regions and extending in a direction different from the first direction; and buried wirings formed in the insulating layer in electrical isolation from the semiconductor substrate and the semiconductor layer, said buried wirings extending in parallel with the bit lines.
申请公布号 US2005093064(A1) 申请公布日期 2005.05.05
申请号 US20040779621 申请日期 2004.02.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OHSAWA TAKASHI
分类号 H01L21/3205;H01L21/8242;H01L23/52;H01L27/01;H01L27/02;H01L27/108;H01L27/12;H01L29/786;(IPC1-7):H01L27/01 主分类号 H01L21/3205
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