发明名称 |
Semiconductor memory and process for fabricating the same |
摘要 |
In a semiconductor memory, a barrier layer formed of a first metal film, a metal nitride film and a second metal film laminated in the named order is formed under a lower electrode of a ferroelectric capacitor in a memory cell, in order to minimize a pealing and lifting of the lower electrode from an underlying plug in the process of forming a ferroelectric material film as a capacitor dielectric film and in its succeeding annealing process. The metal nitride film is formed of a nitride of a metal constituting the first or second metal film.
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申请公布号 |
US6887752(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20030690316 |
申请日期 |
2003.10.21 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SHINOHARA SOTA;TAKEMURA KOICHI;TSUJITA YASUHIRO;MORI HIDEMITSU |
分类号 |
H01L21/28;H01L21/02;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;H01L27/115;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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