发明名称 Semiconductor memory and process for fabricating the same
摘要 In a semiconductor memory, a barrier layer formed of a first metal film, a metal nitride film and a second metal film laminated in the named order is formed under a lower electrode of a ferroelectric capacitor in a memory cell, in order to minimize a pealing and lifting of the lower electrode from an underlying plug in the process of forming a ferroelectric material film as a capacitor dielectric film and in its succeeding annealing process. The metal nitride film is formed of a nitride of a metal constituting the first or second metal film.
申请公布号 US6887752(B2) 申请公布日期 2005.05.03
申请号 US20030690316 申请日期 2003.10.21
申请人 NEC ELECTRONICS CORPORATION 发明人 SHINOHARA SOTA;TAKEMURA KOICHI;TSUJITA YASUHIRO;MORI HIDEMITSU
分类号 H01L21/28;H01L21/02;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;H01L27/115;(IPC1-7):H01L21/824 主分类号 H01L21/28
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