发明名称 |
Method of thermosonic wire bonding process for copper connection in a chip |
摘要 |
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200 Å. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.
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申请公布号 |
US6886735(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20030340756 |
申请日期 |
2003.01.13 |
申请人 |
NATIONAL CHUNG CHENG UNIVERSITY |
发明人 |
JENG YEAU-REN;WANG CHANG-MING |
分类号 |
B23K20/00;B23K20/10;H01L23/485;(IPC1-7):B23K31/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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