| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold joining apparatus with which a lower mold is placed on a plurality of placing rods, the mating surface of the lower mold is manually or automatically coated with an adhesive and the mating surface of the upper mold is matched onto the mating surface of the lower mold, the upper surface of the upper mold is pressed with a plurality of pushing rod, and the upper mold and the lower mold are held and pressed with the placing rods and the pushing rods and one pair of the upper and the lower molds are joined with the adhesive, and thus the crack and the partial breakage of the mold is prevented and the upper mold and the lower mold are well joined. SOLUTION: The mold joining device is provided with the plurality of placing rods 2 on which the lower surface is placed, the lower mold in the mold W being composed of a half-sectional upper mold W<SB>1</SB>and lower mold W<SB>2</SB>, and the plurality of pushing rods 3 which can push the upper surface of the upper mold, and a floating mechanism 11 for freely floating the lower end parts of the pushing rods. COPYRIGHT: (C)2005,JPO&NCIPI
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