| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package which is miniaturized and reduces the cost by smoothly filling through-holes with heat resistive resin paste, forming bump pads just on the through-holes and cutting off the through-holes. SOLUTION: The electronic component package uses bumps for connection terminals, stacks a plurality of bumps and mounts them on a board. Through-holes are smoothly filled with heat resistive resin paste, bump pads are formed just on the through-holes and the through-holes are cut off. COPYRIGHT: (C)2005,JPO&NCIPI
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