发明名称 |
Panel units having in situ formed moldings |
摘要 |
Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.
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申请公布号 |
US2005087907(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20040986789 |
申请日期 |
2004.11.15 |
申请人 |
TOKAI KOGYO KABUSHIKI KAISHA |
发明人 |
HANAI NAOTAKA;SAKAGAMI TOMOHIRO;KAKUTO TOSHIAKI;TANAKA TAKANORI |
分类号 |
B60J1/00;B29C47/02;B29C47/12;B29C70/76;B29L31/30;B29L31/58;B60J10/02;(IPC1-7):B29C47/02 |
主分类号 |
B60J1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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