发明名称 Panel units having in situ formed moldings
摘要 Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.
申请公布号 US2005087907(A1) 申请公布日期 2005.04.28
申请号 US20040986789 申请日期 2004.11.15
申请人 TOKAI KOGYO KABUSHIKI KAISHA 发明人 HANAI NAOTAKA;SAKAGAMI TOMOHIRO;KAKUTO TOSHIAKI;TANAKA TAKANORI
分类号 B60J1/00;B29C47/02;B29C47/12;B29C70/76;B29L31/30;B29L31/58;B60J10/02;(IPC1-7):B29C47/02 主分类号 B60J1/00
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