| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of boring a plurality of contact holes in a flattened inter-layer insulating film through one process. SOLUTION: A substrate has a plurality of filming layers where filming patterns are formed respectively, inter-layer films which are formed between the plurality of filming layers, a plurality of inter-layer film lower wiring patterns 6a2 which are formed right below a flattened inter-layer film 43 among the inter-layer films, a plurality of contact holes 804 and 113 which are formed in the flattened inter-layer film 43 to connect the plurality of inter-layer film lower wiring patterns 6a2 and the filming pattern above the flattened inter-layer film 43 to each other, and one or more dummy patterns 122 and 123 which are formed on one or more filming layers below the plurality of inter-layer film lower wiring patterns 6a2 at a plurality of positions below the plurality of contact holes 804 and 113 and control positions of surfaces of the plurality of inter-layer film lower wiring patterns 6a2. COPYRIGHT: (C)2005,JPO&NCIPI |
