发明名称 |
Apparatus for electrochemical processing |
摘要 |
A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.
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申请公布号 |
US6884153(B2) |
申请公布日期 |
2005.04.26 |
申请号 |
US20030445239 |
申请日期 |
2003.05.23 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MANENS ANTOINE P.;BUTTERFIELD PAUL D. |
分类号 |
B23H5/08;B24B37/04;B24B53/007;B24D13/14;H01L21/321;(IPC1-7):B24B1/00;H01L21/302 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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