发明名称 |
LASER DIODE MODULE, LASER DEVICE, AND LASER PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser diode module which is capable of outputting a laser beam stably for a long term, to provide a laser device using the laser diode module, and to provide a laser processing device. SOLUTION: Sub-mount boards 602 are each bonded on both the surfaces of a laser diode 601 through the intermediary of a hard solder layer 603. The lower sub-mount board 602 is bonded to a heatsink 605 with a soft solder layer 606. The heatsink 605 and a pressing electrode 608 are fixed through the intermediary of an insulating spacer 609 separately from each other by a prescribed space. A coil electrode 607 is fitted into a V-shaped groove cut in the pressing electrode 608, and the coil electrode 607 is elastically deformed a little so as to be pressed against the upper sub-mount board 602. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005108907(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20030336594 |
申请日期 |
2003.09.29 |
申请人 |
LASERFRONT TECHNOLOGIES INC |
发明人 |
KOUDA HIKARI;TAKAHASHI HISAYA;ONO HIDEYUKI;IKEDA YUZO;TSUNEKANE MASAKI;ISHIDA HISANORI;KUBOTA KEIICHI |
分类号 |
H01S5/022;H01S5/02;H01S5/024;H01S5/40;(IPC1-7):H01S5/022 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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