| 摘要 |
<P>PROBLEM TO BE SOLVED: To find a terminal point during chemical mechanical polishing (CMP) treatment. <P>SOLUTION: A reflection spectrum data sample is received corresponding to a plurality of spectra of a light reflected from the irradiation part of a wafer surface. The reflection spectrum data sample is normalized by using normalization reference comprising a first reflection spectrum data sample obtained before the CMP treatment stage. Further, the normalization reference is updated during treatment by using second reflection spectrum data sample obtained in a stage before the CMP treatment. The second reflection spectrum data sample is obtained after the first reflection spectrum data sample. The terminal point is decided based on optical interference which happens to reflection spectrum data. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
