| 发明名称 |
ADHESIVE FILM AND FLEXIBLE METAL CLAD LAMINATED SHEET ENHANCED IN HYGROSCOPIC SOLDER RESISTANCE OBTAINED BY USING THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for use in obtaining a flexible metal clad laminated sheet excellent in hygroscopic solder resistance, and the flexible metal clad laminated sheet obtained by laminating a metal foil to the adhesive film. SOLUTION: The adhesive film is constituted by providing an adhesive layer containing a thermoplastic polyimide at least on one side of a polyimide film. The glass transition temperature of the adhesive layer is 235-300°C and the storage elastic modulus thereof within a range of 260-300°C is 10<SP>8</SP>-10<SP>10</SP>Pa. The flexible metal clad laminated sheet is obtained by laminating the metal foil to the adhesive film. COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005096251(A) |
申请公布日期 |
2005.04.14 |
| 申请号 |
JP20030332715 |
申请日期 |
2003.09.25 |
| 申请人 |
KANEKA CORP |
发明人 |
KIKUCHI TAKESHI;TSUJI HIROYUKI |
| 分类号 |
B32B27/34;B32B15/08;B32B15/088;C08G73/10;C09J7/02;C09J179/08;(IPC1-7):B32B27/34 |
主分类号 |
B32B27/34 |
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