Multichipmodul mit einem Substrat, das eine Gruppierung von Verbindungsanordnungen aufweist,申请号DE2003192312T-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Multichipmodul mit einem Substrat, das eine Gruppierung von Verbindungsanordnungen aufweist
摘要
申请公布号	DE10392312(T5)	申请公布日期	2005.04.14
申请号	DE2003192312T	申请日期	2003.11.18
申请人	FAIRCHILD SEMICONDUCTOR CORP., SOUTH PORTLAND	发明人	JOSHI, RAJEEV;ESTACIO, MARIA CHRISTINA B.
分类号	H05K1/03;H05K1/14;H05K1/18;H05K3/34;(IPC1-7):H05K7/20	主分类号	H05K1/03
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Method for establishing a group call in a GPRS telecommunications system

CARBON FIBER REINFORCED RESIN COMPOSITION, MOLDING MATERIAL AND MOLDED ARTICLE THEREFROM

Thiocarboxylic acid ester and method for stabilizing the same

Ink jet printer, ink jet head and image forming method

Anterior spinal anchor plate

A system for capturing and archiving motion video segments

Antistatic compositions and thermally developable photographic materials containing the same

Cooking containers

Electronic test system

Cross beam connecting the two side regions of a vehicle structure

Vehicle control device with power steering device

MOTOR VEHICLE ELECTRIC SYSTEM

POINT D'INFORMATION AVEC DEPLACEMENT VERTICAL D'ECRAN

LUMINAIRE DECORATIF AVEC EQUIPEMENT ELECTRIQUE INCORPORE.

MACHINE DE GRILLADE SUR CHARBON A ROTATION ELECTRIQUE.

CONTENEUR, EN PARTICULIER POUR FEUILLES ET ANALOGUES.

COMPOSITIONS DE LEVURE LIQUIDE

Holding material for catalytic converter and method for producing the same

Porous cleaning member for medical tubes e.g. an endoscope tube