| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition suited for use in electronic components, being desirable for lamination, and having, especially, storage stability, adhesive strength and, high modulus of elasticity even at elevated temperatures and to provide an adhesive film using the same. <P>SOLUTION: The lamination adhesive composition is one used, for example, to bond a copper foil to a glass epoxy substrate and comprises a carbodiimide resin (a) and a high-molecular-weight epoxy resin (b) of an average molecular weight of 500 or higher in such amounts that 30 to 200 pts.wt. (b) is present per 100 pts.wt. (a). The adhesive film using the same is also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
