发明名称 METHOD OF MANUFACTURING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To efficiently manufacture an electronic part which is equipped with an external electrode that is high in dimensional accuracy and has no defect such as pinholes or the like, and excellent in reliability. SOLUTION: A first conductive paste layer 11 is formed on a flat plate 10, an electronic element 1 is dipped into the first conductive paste layer 11, a conductive paste film 13 is formed on the electronic part element 1, then a second conductive paste layer 12 thinner than the first conductive paste layer 11 is quickly formed in a region adjacent to a region where the first conductive paste layer 11 is formed on the flat plate 1, and a part of the electronic element 1 where the conductive paste film 13 is formed is dipped into the second conductive paste layer 12. By this setup, the electronic part element 1 can be dipped into the second conductive paste layer 12 before the second conductive paste layer 12 gets dry, in a state that the conductive paste film 13 formed on the electronic part element 1 is not dried out yet, and excessive conductive paste is transferred from the conductive paste film 13 to the second conductive paste layer 12 and then removed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101104(A) 申请公布日期 2005.04.14
申请号 JP20030330389 申请日期 2003.09.22
申请人 MURATA MFG CO LTD 发明人 TSUTSUMINO MASAMI;UEDA YASUNORI
分类号 H01G4/12;H01G4/30;H01G13/00;(IPC1-7):H01G4/30 主分类号 H01G4/12
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