| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film wiring layer securing heat resistance and moisture resistance effective as a wiring layer for a planar display device. SOLUTION: The thin film wiring layer formed on a substrate comprises a main conductor layer containing as a main component Cu or Ag and a coating layer covering the main conductor layer. The coating layer contains 7 to 15 at % one or two or more added elements selected from among (Ti, Zr, Hf, V, Nb, Ta, Mo and W) and the balance composed of an alloy layer mainly made up of Ni. When the main conductor layer contains Ag as a main component, the coating layer contains the added elements preferably selected from (Ti, Zr and Hf) and when the main conductor layer contains Cu as a main component, the coating layer contains the added elements preferably selected from (Nb, Ta, Mo and W). COPYRIGHT: (C)2005,JPO&NCIPI
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