| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for etching an article with an improved etching factor. SOLUTION: The etching device has a supplying unit 45 for supplying an etchant for etching a material to be etched; a plurality of nozzles N formed in the supplying unit 45 for spraying the etchant to the perimeter and center of the material 50 to be etched; and a configuration for etching the material while changing the relative positions of the nozzles N with respect to the material 50. There are two configurations of changing the relative positions of the nozzles N with respect to the material 50 to be etched. The first is the configuration of moving the nozzles N and the second is the configuration of moving the material to be etched. COPYRIGHT: (C)2005,JPO&NCIPI
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